C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
149/12
C23F 1/00 (2006.01) C03C 23/00 (2006.01) C23G 1/00 (2006.01) C23G 5/02 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1094929
ADHESION PROMOTER FOR ADDITIVELY PLATED PRINTED CIRCUIT BOARDS Abstract Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing. EN9-77-003 DLM/M14
313822
Babcock Thomas C.
Ellis Theron L.
Majka Henry C.
Gowling Lafleur Henderson Llp
International Business Machines Corporation
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