C - Chemistry – Metallurgy – 23 – F
Patent
C - Chemistry, Metallurgy
23
F
356/16
C23F 1/02 (2006.01) B44C 1/22 (2006.01) C03C 15/00 (2006.01) C23C 22/24 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1271264
ADHESION PROMOTING PROCESS FOR FABRICATING MULTILAYER CIRCUIT BOARDS ABSTRACT OF THE DISCLOSURE Printed circuit boards having copper circuit patterns coated with an adhesion promoter (e.g., copper oxide, tin) are subjected to the action of an aqueous chromic acid solution prior to incorporation in a multi- layer board by interposing layers of semi-cured polymeric non-conductive material between the individual boards and laminating the assembly using heat and pressure. The chromic acid treatment serves to improve adhesion between the layers and, in particular, to overcome or minimize the "pink ring" effect which is frequently observed around holes drilled through multilayer boards.
562724
Cordani John L.
Macdermid Incorporated
Perley-Robertson Hill & Mcdougall Llp
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