Adhesion promotion in photoresist lamination and processing

Details Adhesion promotion in photoresist lamination and processing Adhesion promotion in photoresist lamination and processing

G - Physics

03

F

96/256

G03F 7/26 (2006.01) G03F 7/11 (2006.01) H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1295169

TITLE ADHESION PROMOTION IN PHOTORESIST LAMINATION AND PROCESSING ABSTRACTION OF THE INVENTION Use of a photoresist is improved due to increased adhesive to a substrate through an additive in the resist of a condensation polymer of formaldehyde, toluene sulfonamide and either a triazine such as melamine or hydantoin.

531062

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