Adhesion promotor for thermoplastic substrates

Details Adhesion promotor for thermoplastic substrates Adhesion promotor for thermoplastic substrates

C - Chemistry, Metallurgy

09

J

154/140, 117/221

C09J 5/02 (2006.01) C08J 7/02 (2006.01) C09J 11/08 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2031489

2031489 9012846 PCTABS00002 This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone.

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