Adhesive

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

6/223, 400/7838

C09J 11/06 (2006.01) C08J 5/12 (2006.01) C09J 177/00 (2006.01)

Patent

CA 2003284

ABSTRACT Inert polymeric materials, for example polyamides, are bonded by applying to one or both surfaces a composition comprising a compound having a phenolic group and having substituents which reduce the toxicity of the compound, the composition being a solvent for the inert polymer, and mating the surfaces. Preferred compounds are carvacrol, and/or thymol. An eutectic mixture of carvacrol and thymol may be used to -20°C. Adhesives according to the invention have a polyamide dissolved in the composition.

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Profile ID: LFCA-PAI-O-1988978

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