C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
6/223, 400/7838
C09J 11/06 (2006.01) C08J 5/12 (2006.01) C09J 177/00 (2006.01)
Patent
CA 2003284
ABSTRACT Inert polymeric materials, for example polyamides, are bonded by applying to one or both surfaces a composition comprising a compound having a phenolic group and having substituents which reduce the toxicity of the compound, the composition being a solvent for the inert polymer, and mating the surfaces. Preferred compounds are carvacrol, and/or thymol. An eutectic mixture of carvacrol and thymol may be used to -20°C. Adhesives according to the invention have a polyamide dissolved in the composition.
Furlong Donald N.
Loder John W.
Wells Darrell
Atochem (australia) Pty. Limited
Australian Gas Light Company (the)
Blake Cassels & Graydon Llp
Industrial Pipe Systems Pty. Limited
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