Adhesive and use of the adhesive for the formation of bonds

Details Adhesive and use of the adhesive for the formation of bonds Adhesive and use of the adhesive for the formation of bonds

C - Chemistry, Metallurgy

09

J

154/141, 400/741

C09J 175/12 (2006.01) C08G 18/08 (2006.01) C08G 18/12 (2006.01) C08G 18/42 (2006.01) C08G 18/72 (2006.01) C09J 175/06 (2006.01)

Patent

CA 1315454

ADHESIVE AND USE OF THE ADHESIVE FOR THE FORMATION OF BONDS ABSTRACT OF THE DISCLOSURE An adhesive consisting substantially of an aqueous solution or dispersion of a polyurethane containing chemically incorporated carboxylate and/or sulphonate groups is prepared from a specific mixture of two (cyclo)-aliphatic diisocyanate and selected polyester diols based on (i) adipic acid and (ii) tetramethylenediol, hexamethylenediol or mixtures of these diols. Said polyurethane is virtually free from built in ethylene oxide units situated in polyether end chains or side chains. The use of such aqueous solutions for the formation of bonds on any substrates is disclosed.

545033

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