Adhesive attachment with electrical ground

Details Adhesive attachment with electrical ground Adhesive attachment with electrical ground

B - Operations, Transporting

23

B

B23B 3/24 (2006.01)

Patent

CA 2569875

An adhesive attachment (26) is provided for securely mounting an attachment component (20) such as a threaded stud (20) or the like on the surface of a selected substrate, wherein the adhesive attachment (26) provides an electrically conductive ground path for grounding the attachment component and/or a selected structure mounted thereto to the substrate. In one preferred form, the attachment component is a threaded element (20) such as a stud or nut. Upon mounting of the attachment component on the substrate and subsequent connection of the threaded element to a mating threaded member, e.g., of the selected structure to be mounted onto the attachment component, a conductive ground pin (18) is pressed into electrical contact with the substrate for grounding the attachment component and/or the selected structure mounted thereto.

L'invention concerne une fixation adhésive pour monter de manière fiable un élément de fixation tel qu'un boulon fileté ou un élément similaire sur la surface d'un support déterminé. La fixation adhésive fournit un passage à la terre électriquement conducteur pour relier l'élément de fixation et/ou une structure sélectionnée montée sur celui-ci au support. Dans un mode de réalisation, l'élément de fixation est fileté tel qu'un boulon ou un écrou. L'élément de fixation étant monté sur le support et l'élément fileté étant relié subséquemment à un élément fileté correspondant, par exemple, de la structure sélectionnée à monter sur l'élément de fixation, une cheville de mise à la terre est mise en contact électrique avec le support pour mettre à la terre l'élément de fixation et/ou la structure sélectionnée montée sur celui-ci.

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