C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 5/06 (2006.01) C03C 27/04 (2006.01)
Patent
CA 2386779
A bonding method which includes heating an electrically conductive substrate with an induction heating system. The electrically conductive substrate is suitable for receiving a bonding agent which includes a pressure sensitive adhesive or a hot melt adhesive. The bonding agent is attached to a non- conductive substrate. The contact surface of the substrate is heated with the induction heating system to elevate the temperature of the contact surface. The heated surface enhances the wet out of the bonding agent upon application of the bonding agent onto the substrate.
L'invention concerne un procédé de collage consistant à chauffer un substrat électroconducteur à l'aide d'un système de chauffage à induction. Ce substrat est conçu pour recevoir un liant comprenant un adhésif autocollant ou un adhésif à chaud. Le liant est fixé à un substrat non conducteur. La surface de contact du substrat est chauffée à l'aide du système de chauffage à induction de manière à augmenter la température de ladite surface de contact. La surface chauffée améliore le pouvoir d'imprégnation complète du liant après application de ce liant sur le substrat.
3m Innovative Properties Company
Smart & Biggar
LandOfFree
Adhesive bonding method and device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive bonding method and device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive bonding method and device will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1922845