Adhesive bonding to polymer surfaces

C - Chemistry – Metallurgy – 08 – J

Patent

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Details

117/26, 204/91.3

C08J 7/18 (2006.01)

Patent

CA 1334185

The present invention relates to a process of bonding a polymeric article comprising a semicrystalline polymer having on at least one surface thereof areas having thicknesses of at least 5 nm of the same polymer in a quasi-amorphous state and having an adhesive on said at least one surface, said process comprising contacting said adhesive material to another surface under conditions of heat, pressure or other applied energy sufficient to cause bonding of said adhesive to said another surface and to articles bondable by the process. Semicrystalline polymers of the articles thus can have predetermined amounts of their surfaces rendered quasi-amorphous by irradiation. Polymer surfaces which are so modified can display enhanced ability to accept bonding to other materials, particularly adhesives.

561579

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