C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
117/31, 400/4044
C09J 177/00 (2006.01) B29C 61/06 (2006.01) C08L 77/00 (2006.01) C09J 7/02 (2006.01) C09J 123/08 (2006.01) H01B 3/30 (2006.01)
Patent
CA 1337089
An adhesive composition particularly useful for bonding a heat-recoverable polymeric sleeve around a cable splice to form a cable splice case comprises a polyamide and a copo- lymer of ethylene and an ester of an ethylenically unsa- turated carboxylic acid, said copolymer having a melt flow index of at least 40 as measured according to ASTM D12380-70; the amount of copolymer being at least 38% based on the weight of the polyamide.
589383
Dierickx Etienne L.
Overbergh Noel M.
Dierickx Etienne L.
Marks & Clerk
N.v. Raychem S.a.
Overbergh Noel M.
LandOfFree
Adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1198496