Adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

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117/31, 400/4044

C09J 177/00 (2006.01) B29C 61/06 (2006.01) C08L 77/00 (2006.01) C09J 7/02 (2006.01) C09J 123/08 (2006.01) H01B 3/30 (2006.01)

Patent

CA 1337089

An adhesive composition particularly useful for bonding a heat-recoverable polymeric sleeve around a cable splice to form a cable splice case comprises a polyamide and a copo- lymer of ethylene and an ester of an ethylenically unsa- turated carboxylic acid, said copolymer having a melt flow index of at least 40 as measured according to ASTM D12380-70; the amount of copolymer being at least 38% based on the weight of the polyamide.

589383

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