Adhesive composition

Details Adhesive composition Adhesive composition

C - Chemistry, Metallurgy

09

J

C09J 109/02 (2006.01) C08G 59/40 (2006.01) C08G 59/44 (2006.01) C08G 59/50 (2006.01) C09J 163/00 (2006.01) H05K 1/03 (2006.01) H05K 3/28 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2149972

There is provided an adhesive composition for use in a flexible printed circuit board, comprising: (a) an epoxy resin having substantially at least two epoxy groups per molecule; (b) at least one selected from carboxyl group- containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and (c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65 (c1) / (c2) 99/1, and a flexible printed circuit board having excellent soldering heat resistance.

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