Adhesive composition

Details Adhesive composition Adhesive composition

C - Chemistry, Metallurgy

09

J

C09J 133/06 (2006.01) B32B 7/12 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2143170

An adhesive composition includes from about 30 weight percent to about 70 weight percent solids dispersed in an aqueous medium. The solids include from about 60 weight percent to about 97.9 weight percent of a polymer having a glass transition temperature of about -40°C to about 10°C and including first repeating units derived from an alkyl (meth)acrylate monomer, a vinyl ester monomer, a styrenic monomer or a mixture thereof and second repeating units derived from a hydroxyalkyl (meth)acrylate monomer, a monoethylenically unsaturated nitrogenous monomer or a mixture thereof ; from about 2 weight percent to about 30 weight percent of a polyfunctional epoxy resin including two or more epoxide groups per molecule; from about 0.1 weight percent to about 10 weight percent of a polyfunctional curing agent including two or more amino groups or amido groups per molecule; and from about 0.01 weight percent to about 30 weight percent of a metal salt. A method for making a laminate includes applying a layer of the aqueous adhesive composition to a first substrate layer and covering the layer of adhesive composition with a second substrate layer to form the laminated article. A laminate includes two substrate layers bonded together by an interposed layer of the solids of the adhesive composition.

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