Adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 153/00 (2006.01) C09J 11/00 (2006.01) C09J 11/08 (2006.01)

Patent

CA 2192866

Described is an adhesive composition suitable for a hot melt adhesive or hot melt type pressure-sensitive adhesive, which comprises a block copolymer (a) and a tackifier (b), wherein said block copolymer (a) having at least one polymer block A being a hydrogenated butadiene polymer block having a 1,2-bond content of 20 mole% or smaller and at least one polymer block B substantially having an olefin polymer structure different from the polymer block A and having a glass transition temperature of -20°C or lower and heat of crystalline fusion of 8 cal/g or lower, and containing the polymer block A before hydrogenation in an amount of 3 to 80 wt. o; which is excellent in various properties such as process stability, adhesion, creep resistance, flexibility at low temperature and solvent resistance; and which can be used widely for packing, bookbinding, plywood, woodworking, making shoes, adhesion of textile goods and production of various kinds of adhesive goods such as adhesive tapes and labels.

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