Adhesive composition and process for bonding

Details Adhesive composition and process for bonding Adhesive composition and process for bonding

C - Chemistry, Metallurgy

08

L

154/104, 400/182

C08L 23/00 (2006.01) B32B 27/00 (2006.01) C08L 93/04 (2006.01) C09J 123/08 (2006.01) C09J 191/06 (2006.01)

Patent

CA 1133177

ADHESIVE COMPOSITION AND PROCESS FOR BONDING (Case B) Abstract of the Disclosure An adhesive composition effective in bonding low-energy plastic surfaces to each other which provides improved low tempera- ture performance containing the following components: (1) a first ethylene-vinyl ester copolymer having from about 4 to about 35 weight percent of a vinyl ester; (2) a second ethylene-vinyl ester copolymer having an excess of 35 weight percent of a vinyl ester; (3) a tackifier selected from the following group (a) a rosin, (b) a rosin ester, (c) a terpene resin, (d) a terpene-phenolic resin and (e) a rosin-modified phenolic resin; and (4) a polyethylene wax having a molecular weight of about 600 to about 3000 and a process for bonding low-energy plastic surfaces to each other.

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