Adhesive composition for hot bonding and bonding method...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 179/08 (2006.01) B32B 3/12 (2006.01) C09J 5/06 (2006.01) B64C 27/473 (2006.01)

Patent

CA 2296043

The invention concerns an adhesive composition (34) for hot bonding polymer or metal substrates (32, 33), comprising at least one polymer material, at least one plasticizing and wetting agent, and, optionally, at least a solvent, and its working temperature is lower than the degradation temperature of the substrates (32, 33) and lower than the melting temperature of the polymer material. The invention is useful for producing sandwich structures of aeronautical quality, in particular for helicopter rotors.

La composition adhésive (34) selon l'invention pour le collage à chaud de substrats (32, 33) polymères ou métalliques, comprend au moins un matériau polymère, au moins un agent plastifiant et mouillant, et, éventuellement, au moins un solvant, et sa température de mise en oeuvre est inférieure à la température de dégradation des substrats (32, 33) et inférieure à la température de fusion du matériau polymère. Application à la réalisation de structures sandwich de qualité aéronautique, notamment pour rotors d'hélicoptères.

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