C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 153/02 (2006.01) B32B 27/32 (2006.01) C08L 53/02 (2006.01)
Patent
CA 2676626
The invention relates to a heat-meltable pressure-sensitive adhesive (HMPSA) composition that comprises: a) 25 to 50 % of a mixture of styrene block copolymers of the SBS and SB types; b) 45 to 75 % of compatible tackifying resins having a softening temperature of between 80 and 150° C; c) 0.5 to 5.5 % of fatty acids in which the hydrocarbon chain contains from 10 to 22 carbon atoms. The invention also relates to a multi-layered system including an HMPSA layer, a printable substrate layer and an adjacent protection layer. The invention also relates to a corresponding pressure-sensitive adhesive label and to a method for recycling a labelled article that comprises removing said label by immersing the article in a hot basic aqueous solution.
Composition adhésive thermofusible sensible à la pression (HMPSA) comprenant : a) de 25 à 50 % d'un mélange de copolymères blocs styréniques de type SBS et SB; b) de 45 à 75 % de résines tackifiantes compatibles ayant une température de ramollissement comprise entre 80 et 150 °C; c) de 0,5 à 5,5 % d 'acides gras dont la chaîne hydrocarbonée comprend de 10 à 22 atomes de carbone. Système multicouche comprenant une couche d'HMPSA, une couche support imprimable et une couche protectrice adjacente. Etiquette auto-adhésive correspondante et procédé de recyclage d'un article étiqueté avec décollement de ladite étiquette par immersion de l'article dans une solution aqueuse basique à chaud.
Fouquay Stephane Andre
Goubard David
Bostik S.a.
Robic
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