Adhesive composition for vinyl halide type resin

Details Adhesive composition for vinyl halide type resin Adhesive composition for vinyl halide type resin

C - Chemistry, Metallurgy

09

J

400/5921

C09J 163/00 (2006.01) C08G 59/50 (2006.01) C09J 127/06 (2006.01) C09J 131/04 (2006.01)

Patent

CA 1335140

An adhesive composition for a vinyl halide type resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality of ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.

587548

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