Adhesive composition of low molecular weight...

Details Adhesive composition of low molecular weight... Adhesive composition of low molecular weight...

C - Chemistry, Metallurgy

08

G

C08G 73/02 (2006.01) B27N 3/00 (2006.01) D21H 17/55 (2006.01)

Patent

CA 2661466

The invention is directed to compositions containing polyamidoamine-epihalohydrin resins (PAE resins) of low molecular weight and a soy protein or lignin in which the weight ratio of protein or lignin to PAE is 100:0.1 to 0.1:100. The invention is also directed to the use of the compositions as adhesives for binding wood materials.

L'invention concerne des compositions formées de résines de polyamidoamine-épihalohydrine (résines PAE) de faible poids moléculaire et d'une protéine de soja ou de lignine, le rapport pondéral entre la protéine ou la lignine et les résines PAE variant de 100:0,1 à 0,1:100. L'invention concerne également l'utilisation des compositions comme adhésifs pour lier les matériaux à base de bois. La viscosité inférieure de l'adhésif permet d'obtenir de meilleures propriétés de manipulation, permettant également de réduire la quantité d'eau dans la formulation adhésive. La viscosité inférieure permet d'améliorer la manipulation du matériau adhésif et le délai d'utilisation de la formulation adhésive.

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