C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/7025, 6/86,
C08K 5/09 (2006.01) C08J 3/02 (2006.01) C08K 5/098 (2006.01) C08L 1/08 (2006.01) C08L 57/00 (2006.01)
Patent
CA 1065518
ABSTRACT OF THE DISCLOSURE This invention relates to thickened solutions of film forming polymers especially to thickened adhesive compositions. Solutions of film forming polymers are widely used as adhesives and lacquers but the standard liquid adhesive and lacquer compositions have a number of disadvantages, principally a tendency to run when applied to inclined or vertical surfaces, and a tendency to "tail". "Tailing" is the name given to the tendency of the liquid adhesive or lacquer compositions to form strands or "tails" between the work surface and the application device, whether it be a hand held spreader, a tube or a bottle, as the device is removed from the work surface after application of the adhesive. Accordingly the invention is based on the discovery that standard liquid adhesive and lacquer compositions can be improved, the tendency to run and "tail" being reduced, by incorporating a thickening or gelling agent in the composition, and provides a method of thickening a solution of a film-forming polymermaterial in a solvent of dielectric constant in the range 5.0 to 50.0, comprising mixing with said solution at a temperature above room tem- perature, an alkali metal salt of a C8-36 fatty acid and allowing the mixture to cool without substantial agitation.
237141
Dickmann Heinz H.
Hechenberger Dieter A.
Krattner Richard W.
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