Adhesive compositions and methods of use

Details Adhesive compositions and methods of use Adhesive compositions and methods of use

C - Chemistry, Metallurgy

09

J

C09J 4/06 (2006.01) B05D 7/24 (2006.01) C09J 4/00 (2006.01) C09J 7/02 (2006.01) C09J 9/02 (2006.01) C09K 5/00 (2006.01) H05K 3/32 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2254883

A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat- curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.

Composition adhésive qui peut être imprimée sur cadre et appliquée à un substrat à température ambiante, composée de ce qui suit: au moins un acrylate d'alkyle; au moins un comonomère de renforcement; une résine polyépoxy et un agent de polymérisation de la résine polyépoxy. Cette composition est sensiblement exempte de solvants et a une limite apparente d'élasticité supérieure à 3 Pascals et une viscosité inférieure à 6000 centipoises. Dans un autre de ses aspects, l'invention décrit des films adhésifs polymérisables à la chaleur qui ont des propriétés électro/conductrices et/ou thermoconductrices et qui sont des polymères acryliques sensiblement exempts de solvants et comprenant une résine polyépoxy, un agent de polymérisation de la résine polyépoxy et un matériau électroconducteur et/ou un matériau thermoconducteur.

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