Adhesive compositions based upon thermoplastic polyamides

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1706, 400/18

C08L 77/08 (2006.01) C08G 69/34 (2006.01) C08G 69/40 (2006.01) C09J 177/08 (2006.01)

Patent

CA 1175985

ABSTRACT OF THE DISCLOSURE This invention relates to adhesive composition. More particu- larly, this invention relates to adhesive compositions comprising polyamide (I) prepeared by condensing dimeric higher fatty acids and monomeric fatty acids with polyether diamines and aliphatic or cycloaliphatic diamines and polyamide (II) prepared by con- densing dimeric higher fatty acids and monomeric fatty acids with aliphatic or cycloaliphatic polyamines.

398825

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