Adhesive compositions, bonding films made therefrom and...

Details Adhesive compositions, bonding films made therefrom and... Adhesive compositions, bonding films made therefrom and...

C - Chemistry, Metallurgy

09

J

C09J 4/06 (2006.01) C08F 283/10 (2006.01) C08G 59/50 (2006.01) C08G 59/70 (2006.01) C09J 7/00 (2006.01) C09J 163/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2224809

A photostable adhesive composition comprises: a) an aromatic polyepoxide; b) a heat activated curative for polyepoxide; c) a thermoplastic polymer; d) a polyfunction (meth)acrylate; and e) optionally, a bireactive compound that contains at least one (meth)acrylate group and at least one group that is reactive with aromatic polyepoxide. The adhesive compositions can be used to prepare adhesive bonding films in a process that uses electron beam irradiation.

Une composition adhésive photostable comprend: a) un polyépoxide aromatique; b) un agent de durcissement thermoactivé pour polyépoxide; c) un polymère thermoplastique; d) un (meth)acrylate polyfonctionnel; et e) éventuellement, un composé biréactif qui contient au moins un groupe (meth)acrylate et au moins un groupe qui entre facilement en réaction avec un polyépoxide aromatique. Les compositions adhésives peuvent être utilisées pour la préparation de films de liaison dans un procédé qui utilise le rayonnement par faisceau d'électrons.

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