Adhesive compositions comprising a polyfarnesene

C - Chemistry – Metallurgy – 08 – F

Patent

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Details

C08F 36/22 (2006.01) C08L 47/00 (2006.01) C09J 147/00 (2006.01)

Patent

CA 2735255

Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopoly-mer derived from a farnesene (e.g., .alpha.-farnesene or .beta.- farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an .alpha.-olefin such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combina-tion thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.

L'invention concerne une composition adhésive comprenant un polyfarnesène et un agent poisseux. Le polyfarnesène peut être un homopolymère farnesène dérivé d'un farnesène (par exemple, a-farnesène or ß-farnesène) ou un interpolymère farnesène dérivé d'un farnesène et d'au moins un monomère vinylique. Selon certains modes de réalisation, le dit monomère vinylique est l'éthylène, une a-oléf?ne telle que le styrène ou un halogénure vinylique substitué ou non substitué, un acrylonitrile, un ester acrylique, un ester méthacrylique, un acrylamide ou méthacrylamide ou une combinaison de ceux-ci. La composition décrite peut être utilisée comme adhésif thermofusible, adhésif sensible à la pression ou analogue.

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