Adhesive compositions comprising epoxide resin,...

C - Chemistry – Metallurgy – 08 – K

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400/4705, 400/59

C08K 5/37 (2006.01) C08G 59/56 (2006.01) C08G 59/66 (2006.01) C08L 63/10 (2006.01) C09J 163/00 (2006.01)

Patent

CA 1056538

Abstract of the Disclosure Compositions, useful as adhesives, comprise (a) an epoxide resin having glycidyl, .beta.-mehylglycidyl, or 2,3-epoxycyclo- pentyl groups directly attached to oxygen, nitrogen, or sulfur atoms (b) as curing agent for the epoxide resin, either one of certain (cyclo)aliphatic amines or one of certain ter- tiary amines, and also (c) a polymercaptan, and (d) a polyene having at least two activated ethylenic double bonds, each to an atom of oxygen, nitrogen, or sulfur, the sum of these double bonds and of the mercapean groups in the poly- mercaptan being at least 5. The compositions rapidly develop tack, so avoiding the need to hold, for a prolonged period in jigs, clamps, or other devices, objects being bonded together while the epoxide resin cures.

213701

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