Adhesive compositions containing low molecular weight...

Details Adhesive compositions containing low molecular weight... Adhesive compositions containing low molecular weight...

C - Chemistry, Metallurgy

09

J

C09J 153/02 (2006.01) C09J 171/12 (2006.01)

Patent

CA 2056374

2056374 9014396 PCTABScor01 Pressure sensitive and hot melt adhesive compositions having improved shear adhesion failure temperatures (SAFT) comprising: (a) a block copolymer having at least two monoalkenyl arene polymer endblocks (A) and at least one elastomeric conjugated-diene midblock (B), said blocks (A) comprising 8-55 % by weight of the block copolymer; (b) about 50 to about 200 phr of a tackifying resin compatible with block (B); and (c) about 5 to about 50 phr of a low molecular weight polyphenylene oxide polymer wherein the molecular weight (Mvis) of the polyphenylene oxide polymer is from about 1,000 to about 5,000, the Tg is from about 100· to about 165·C, preferably between 140-163·C.

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