H - Electricity – 01 – R
Patent
H - Electricity
01
R
26/109, 356/11,
H01R 4/04 (2006.01) H01R 43/00 (2006.01) H05K 3/32 (2006.01) H05K 1/18 (2006.01) H05K 3/30 (2006.01) H05K 3/36 (2006.01)
Patent
CA 1220252
ABSTRACT: An adhesive interconnecting means (10) is comprised of one or more conductors (24) on an insulating substrate (20), a first adhesive layer (12), said first layer (12) being an anisotropically conductive adhesive (14) which is disposed over said conductors (24) and substrate (20) and a second adhesive layer (16) said second layer (16) being a flowable adhesive that extends over the anisotropically conductive adhesive layer (12). Upon posi- tioning the first substrate conductors (24) in an overlapping conducting relationship to the second substrate (22) conductors (24) and applying pressure to the positioned areas, the second adhesive layer (16) floors from the positioned areas and exposes the anisotropically conductive layer to electrically interconnect the corresponding conductors accompanied by the adhesion of the remaining surface of the first substrate (10) to the surface of the second substrate (22). A method for interconnecting at least one conductive path means of a first insulating member with at least one conductive means on a second insulating member is also disclosed.
491648
Dery Ronald A.
Jones Warren C.
Amp Incorporated
Smart & Biggar
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