Adhesive for bonding cured epdm rubber

C - Chemistry – Metallurgy – 08 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

400/5030, 400/64

C08K 3/04 (2006.01) C08K 5/01 (2006.01) C08L 53/00 (2006.01) C09J 123/28 (2006.01)

Patent

CA 1317054

ABSTRACT OF THE DISCLOSURE A solvent based contact adhesive suitable for bonding cured EPDM membranes is disclosed. The adhesive includes a crosslinked halogenated butyl rubber, a low molecular weight, high softening point, thermoplastic aliphatic-type-based hydrocarbon resin and at least one organic solvent employed as a dispersion medium for the crosslinked halogenated butyl rubber and the resin. The disclosed adhesive exhibits superior heat aging and hot water immersion properties which are significant characteristics in roof applications.

588780

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Adhesive for bonding cured epdm rubber does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive for bonding cured epdm rubber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive for bonding cured epdm rubber will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1304179

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.