C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/5030, 400/64
C08K 3/04 (2006.01) C08K 5/01 (2006.01) C08L 53/00 (2006.01) C09J 123/28 (2006.01)
Patent
CA 1317054
ABSTRACT OF THE DISCLOSURE A solvent based contact adhesive suitable for bonding cured EPDM membranes is disclosed. The adhesive includes a crosslinked halogenated butyl rubber, a low molecular weight, high softening point, thermoplastic aliphatic-type-based hydrocarbon resin and at least one organic solvent employed as a dispersion medium for the crosslinked halogenated butyl rubber and the resin. The disclosed adhesive exhibits superior heat aging and hot water immersion properties which are significant characteristics in roof applications.
588780
Chmiel Chester T.
Young David A.
Osler Hoskin & Harcourt Llp
Uniroyal Technology Corporation
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