Adhesive for bonding to low surface energy surfaces

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 153/00 (2006.01) B32B 5/18 (2006.01) C08F 297/04 (2006.01) C09J 7/02 (2006.01) C09J 151/00 (2006.01) C09J 153/02 (2006.01)

Patent

CA 2399988

A novel polymodal asymmetric elastomeric block copolymer and a pressure sensitive adhesive, tape and adhesive backed article made therefrom, such as a polymer foam article having a substantially smooth surface prepared by melt- mixing a polymer composition and a plurality of microspheres, at least one of which is an expandable polymeric microsphere, under process conditions, including temperature and shear rate, selected to form an expandable extrudable composition; and extruding the composition through a die.

L'invention concerne un nouveau copolymère séquencé élastomère asymétrique polymodal et un article enduit d'adhésif, sous forme de bande adhésive autocollante, fait à partir de copolymère, tel qu'un article en mousse polymère présentant une surface sensiblement lisse. La préparation de ce copolymère comporte les étapes consistant à mélanger à l'état fondu une composition polymère et une pluralité de microsphères, au moins une de celles-ci étant une microsphère polymère expansible, dans des conditions de traitement incluant température et vitesse de cisaillement, sélectionnées en vue de former une composition expansible pouvant être extrudée ; et extruder la composition à travers une filière.

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