Adhesive for low temperature applications

Details Adhesive for low temperature applications Adhesive for low temperature applications

C - Chemistry, Metallurgy

08

L

C08L 51/00 (2006.01) C08L 51/04 (2006.01) C08L 51/06 (2006.01) C09J 4/06 (2006.01) C09J 133/10 (2006.01) C09J 151/04 (2006.01) C09J 153/00 (2006.01)

Patent

CA 2044861

Adhesive compositions are made from methacrylate ester monomers, elastomeric polymers having a Tg below -25°C and which are soluble in the monomers, core-shell polymers which swell in the monomers but do not dissolve therein, and free radical producing catalysts. These adhesive compositions when used in bonded assemblies exhibit a combination of high adhesive bond impact strength and high bulk tensile elongation.

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