C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
400/6556
C08F 220/10 (2006.01) C08F 224/00 (2006.01)
Patent
CA 2037026
ABSTRACT OF THE DISCLOSURE An adhesive for surface mounting devices comprising a polymerizable prepolymer, a reactive diluent, and a polymerization initiator, the adhesive further comprising as a chelating agent an aminopolycarobxylic acid having at least one hydroxyethyl group bound to the nitrogen atom thereof or an alkali metal salt thereof, and as a curing accelerator cupferron or a metallic salt thereof. - 17 -
Fujii Ryuichi
Nagase Rihei
Fujii Ryuichi
Nagase Rihei
Riches Mckenzie & Herbert Llp
Somar Corporation
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