Adhesive for the manufacture of plywood particle boards,...

Details Adhesive for the manufacture of plywood particle boards,... Adhesive for the manufacture of plywood particle boards,...

C - Chemistry, Metallurgy

08

L

400/1202, 400/13

C08L 61/10 (2006.01) C08L 97/00 (2006.01) C08L 97/02 (2006.01) C09J 161/00 (2006.01) C09J 161/06 (2006.01) C09J 197/00 (2006.01)

Patent

CA 1068426

Abstact of the Disclosure An adhesive for the manufacture of plywood, fiber board, particle board, and similar products, and containing the combination of pehnol formaldehyde resin, and a sulfate lignin. A major portion of the lignin derivatives have a molecular weight of over 5000.

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