Adhesive formulations containing a primary low molecular...

C - Chemistry – Metallurgy – 09 – J

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400/3032

C09J 4/06 (2006.01) C08F 290/04 (2006.01) C08F 290/06 (2006.01) C08F 290/12 (2006.01) C09J 153/02 (2006.01)

Patent

CA 2333557

An adhesive composition including as principal components: (a) about 10-90 % by weight of at least one free radical-polymerizable monomer; (b) about 0-20 % by weight of an adhesion promoter; (c) about 10-80 % by weight of a primary low molecular weight toughener (or toughening agent) with a weight average molecular weight (Mw) less than about 18,000 or a number average molecular number (Mn) less than about 10,000; and (d) about 1-15 % by weight of an auxiliary high molecular weight toughener (or toughening agent) with a Mw greater than about 18,000 or a Mn greater than about 10,000 based on the total weight of components (a)-(d).

Cette composition d'adhésif comporte, comme principaux composants, (a), d'environ 10 à 90 % en pourcentage pondéral d'au moins un monomère à polymérisation radicalaire libre, (b), d'environ 0 à 20 % en pourcentage pondéral d'un agent durcisseur principal de faible poids moléculaire ayant un poids moléculaire moyen en poids (Mw) inférieur à 18 000 environ ou un poids moléculaire moyen en nombre (Mn) inférieur à 10 000 environ et, (d), d'environ 1 à 15 % en pourcentage pondéral d'un agent durcisseur auxiliaire de poids moléculaire élevé dont le Mw est supérieur à 18 000 environ ou dont le Mn est supérieur à 10 000 environ, les pourcentages pondéraux étant fondés sur le poids total des composants (a) - (d).

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