C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/4108, 402/9,
C08K 5/54 (2006.01) C08F 220/06 (2006.01) C08F 290/04 (2006.01) C08F 291/00 (2006.01) C09J 4/00 (2006.01) C09J 151/00 (2006.01) C09J 151/04 (2006.01) C09J 157/00 (2006.01) C09J 167/00 (2006.01) F16B 11/00 (2006.01)
Patent
CA 1039879
Abstract Of The Disclosure New adhesive compositions are described which are capable of providing bonded assemblies at least one element of which is a metal and which are extremely resistant to dele- terious environments, particularly atmospheric moisture and liquid water. The compositions include: (A) about 75 to 99% of any known adhesive composition based on a polymerizable liquid resin containing a compound having a terminal vinyl group, (b) about 0.5 to about 15%, by weight, of ethylenically unsaturated carboxylic acid and (C) about 0.54 to about 10%, by weight, of an organosilicon compound represented by the formula X3Si(CH2)mY in which m is an integer from 0 to 3, Y is an organo-functional group and X is a hydroxyzable group.
181675
Lord Corporation
Na
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