Adhesive layer for a bubble-free adhesive bond

Details Adhesive layer for a bubble-free adhesive bond Adhesive layer for a bubble-free adhesive bond

C - Chemistry, Metallurgy

09

J

C09J 7/00 (2006.01) C09J 7/02 (2006.01)

Patent

CA 2673002

The invention relates to an adhesive layer (3) for a bubble-free adhesive bond, the adhesive layer (3) being formed from an adhesive (4) and there being at least one channel (5) made in the surface of the adhesive (4), characterized in that the adhesive (4) has expanded, and also to a method of producing a sheet-like structure (1) that bonds without bubbles, wherein an adhesive (4) is applied as an adhesive layer (3) to a functional layer (2) and wherein at least one channel (5) is made in the surface of the adhesive (4), characterized in that the adhesive (4) is expanded.

L'invention concerne une couche adhésive (3) qui permet un collage sans bulles. La couche adhésive (3) est formée d'une pâte adhésive (4) et au moins un canal (5) est ménagé à la surface de la pâte adhésive (4). La couche adhésive selon l'invention est caractérisée en ce que la pâte adhésive (4) est expansée. L'invention concerne également un procédé de fabrication d'un produit plat (1) collé sans bulles, dans lequel une pâte adhésive (4) qui sert de couche adhésive (3) est appliquée sur une couche fonctionnelle (2) et dans lequel au moins un canal (5) est ménagé à la surface de la pâte adhésive (4). Le procédé est caractérisé en ce que la pâte adhésive (4) est expansée.

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