Adhesive paste containing polymeric resin

Details Adhesive paste containing polymeric resin Adhesive paste containing polymeric resin

C - Chemistry, Metallurgy

09

J

C09J 11/04 (2006.01) C09J 5/06 (2006.01) C09J 9/02 (2006.01) C09J 201/00 (2006.01) H01L 21/58 (2006.01) H05K 1/09 (2006.01)

Patent

CA 2168427

Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Pâte adhésive constituée de résine polymère organique, d'une charge inorganique et d'un liquide volatil pouvant être utilisée pour des applications de fixation de dés de silicium.

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