Adhesive polyamide resin compositions containing high acid...

Details Adhesive polyamide resin compositions containing high acid... Adhesive polyamide resin compositions containing high acid...

C - Chemistry, Metallurgy

08

L

154/141, 400/170

C08L 77/06 (2006.01) C08L 23/08 (2006.01) C08L 77/00 (2006.01) C09J 123/08 (2006.01) C09J 177/00 (2006.01)

Patent

CA 1110795

ABSTRACT OF THE DISCLOSURE Adhesive polyamide resin compositions, such as hot melts, containing conventional components are improved by inclusion of a normally solid, homogeneous copolymer of ethylene and an unsaturated carboxylic acid having an acid number of at least about 100 and a number average molecular weight between 500 and 5,000.

285745

Affiliated with

Also associated with

Rating

Adhesive polyamide resin compositions containing high acid... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive polyamide resin compositions containing high acid..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive polyamide resin compositions containing high acid... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-159575