Adhesive preparation package

B - Operations – Transporting – 65 – D

Patent

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Details

B65D 75/30 (2006.01) A61L 15/44 (2006.01) A61L 15/58 (2006.01) B65B 11/50 (2006.01) B65D 75/20 (2006.01)

Patent

CA 2511166

The present invention provides an adhesive preparation package containing an adhesive preparation and a packaging film(s) enclosing said preparation, the packaging films being heat-sealed around the adhesive preparation, wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion and a flat heat-sealed portion, and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility.

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