C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 7/02 (2006.01) B43M 5/00 (2006.01) B65B 51/02 (2006.01) B65B 51/06 (2006.01) C09J 153/00 (2006.01) G09F 3/03 (2006.01)
Patent
CA 2532243
An adhesive product which has excellent glue cutting performance and provides an excellent finish to the pasted portion while effectively maintaining security is provided. An adhesive layer 10 is formed through pattern application, where an adhesive 100 is intermittently placed on the surface of a film 12, so that a broken paper phenomenon, such that the surface layer portion of a flap F1 or the vicinity of opening F2 adheres to the surface of the adhesive layer 10, and a white envelope F is ripped in the direction of the thickness, can be caused when a peeling movement for peeling the flap F1 from a state where the white envelope F is sealed via the adhesive layer 10.
Kasahara Hiroyuki
Kawashita Kazushige
Urahama Yoshiaki
Kokuyo S&t Co. Ltd.
Ridout & Maybee Llp
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