Adhesive release agent applied to surface for improved cleaning

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 91/00 (2006.01) A23L 1/00 (2006.01) C08K 5/52 (2006.01) C08L 91/06 (2006.01) C08L 91/08 (2006.01) C09D 191/00 (2006.01) C09D 191/06 (2006.01) C09D 191/08 (2006.01) C09J 7/02 (2006.01) C09J 7/04 (2006.01)

Patent

CA 2219429

The invention relates to methods and compositions for removing bonding agents from the hard surfaces of machinery and, in its most preferred mode packaging equipment. The release composition comprises lecithin and a hydrophobic carrier. The method comprises the steps of applying a release composition to the surfaces of the packaging equipment. The packaging equipment is then used. Any bonding agent deposited on the treated areas of the packaging equipment may then be removed. The invention is applicable to any number of package and container manufacture environments including package assembly, package sealing, product sealing, and labeling.

L'invention concerne des procédés et des compositions destinés à enlever des agents adhésifs des surfaces dures de machines et, dans le mode préféré de réalisation de l'invention, de matériel d'emballage. La composition d'enlèvement adhésif renferme de la lécithine et un support hydrophobe. Le procédé consiste à appliquer une composition d'enlèvement d'adhésif sur les surfaces du matériel d'emballage avant utilisation de ce dernier. Tout adhésif déposé sur les zones traitées du matériel d'emballage peut alors être enlevé. Ladite invention est applicable à n'importe quel type de fabrication d'emballages et de conteneurs, y compris à l'assemblage et à la fermeture d'emballages, à la fermeture de produits et à l'étiquetage.

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