Adhesive removal from printed circuit boards

Details Adhesive removal from printed circuit boards Adhesive removal from printed circuit boards

H - Electricity

05

K

356/12

H05K 3/26 (2006.01) H05K 3/38 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1177579

595-RG-057 ABSTRACT The present invention relates to a semi-additive or full-additive process for producing printed circuit or conductor boards having improved electrical resistance in which the coating of adhesive medium exposed between the trains of conductors is removed or partially removed without corroding the base material or copper of the conductor trains by a treatment with an alkaline permanganate or chromic acid solution and suitable washing steps carried out subsequently.

398778

Affiliated with

Also associated with

Rating

Adhesive removal from printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive removal from printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive removal from printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1241665