C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
154/141, 400/307
C08L 51/06 (2006.01) C09J 4/06 (2006.01)
Patent
CA 1270972
Abstract: The present invention is directed to an adhesive resin composition useful for bonding a resin having gas barrier properties and a hydrophobic thermoplastic resin. The composition comprises an ethylene-acrylate or meth- acrylate copolymer grafted with an ethylenic unsaturated carboxylic acid or its acid anhydride; 0.02 to 0.6 equivalent to the ethylenic unsaturated carboxylic acid or its acid anhydride of a Periodic Table group Ia or IIa metal hydroxide; and optionally an ethylene-acrylate or methacrylate copolymer. The invention is further directed to a laminated material of a resin having gas barrier properties and a hydrophobic thermoplastic resin laminated with the adhesive resin composition and a resin composi- tion comprising the adhesive resin composition, a resin having gas barrier properties and a hydrophobic thermo- plastic resin. The laminated material has properties which make it useful in the food packaging industry.
530601
Akazawa Toshiyuki
Inoue Takashi
Kobayashi Toshitaka
Okaya Takuji
Kirby Eades Gale Baker
Kuraray Co. Ltd.
Nippon Petrochemicals Co. Ltd.
LandOfFree
Adhesive resin composition, laminated material using it and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adhesive resin composition, laminated material using it and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive resin composition, laminated material using it and... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1178700