H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/78 (2006.01) B28D 5/00 (2006.01) C09J 7/02 (2006.01) H01L 21/673 (2006.01) H01L 21/68 (2006.01) H01L 23/29 (2006.01) H01L 23/495 (2006.01)
Patent
CA 2122278
Disclosed is an adhesive sheet for wafer comprising a substrate film and a radiation curable adhesive layer formed thereon, said adhesive sheet being used in a process for preparing a semiconductor device comprising the steps of adhering a back surface of a wafer, a front surface of which has been formed a circuit, onto the radiation curable adhesive layer, dicing the wafer into chips, rinsing, drying, irradiating the adhesive layer with radiation to cure said adhesive layer, expanding the adhesive sheet if necessary to make the chips apart from each other, then picking up the chips, mounting the picked chips on a lead frame, bonding, and molding to give such a structure that the back surfaces of the chips are partially or wholly in contact with a package molding resin, wherein the radiation curable adhesive layer comprises 100 parts by weight of an acrylic adhesive composed of a copolymer of an acrylic ester and an OH group-containing polymerizable monomer and 50 - 200 parts by weight of a radiation polymerizable compound having two or more unsaturated bonds, and the radiation curable adhesive layer has an elastic modulus of not less than 1 × 10 9 dyn/cm2 after curing by irradiation with radiation.
Amagai Masazumi
Ebe Kazuyoshi
Senoo Hideo
Lintec Corporation
Macrae & Co.
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