Adhesive system for heat sealable articles

B - Operations – Transporting – 32 – B

Patent

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Details

154/71.01, 154/7

B32B 7/12 (2006.01) B29C 65/04 (2006.01) B32B 5/02 (2006.01)

Patent

CA 1193957

ABSTRACT OF THE DISCLOSURE The invention relates to improving the seal bond strengths and hot bond strengths in a nonwoven pad or substrate by the use of a vinyl resin latex adhesive system. In the process, a vinyl resin latex containing a plasticizer is applied to the surface of a nonwoven pad and while the latex is still wet, a dry vinyl resin powder, preferably preplasticized, is applied to those areas only that are to be heat sealed. The coated pad or substrate is dried and a fabric, either natural or synthetic, is placed thereover and sealed thereto with heat or a dielectric field, thus forming a composite or laminate suitable for many end uses.

410042

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