H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/194
H01L 21/68 (2006.01) H01L 21/66 (2006.01)
Patent
CA 1325292
- 1 - Abstract: An adhesive tape for bonding a plurality of chips on it is employed in a chip mounting apparatus in which light is applied to one of the chips bonded on the adhesive tape to detect the position of the chip. The adhesive tape consists of at least three layers: a base layer; a film laminated on at least one surface of the base layer and having a reflectance with respect to light different from that of the chip; and an adhesive layer laminated on either one of the base layer and the film to bond the chip on it. The film is, for example, of an anti-reflection film, a light diffusion film, a light reflection film or a light scattering film. The result is an improved optical contrast between the chip and its supporting member and hence improved positioning recognition.
571589
Fujihira Mitsuaki
Nishiguchi Masanori
Kirby Eades Gale Baker
Sumitomo Electric Industries Ltd.
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