Adhesive which hardens in several stages

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

400/4024, 204/91

C09J 4/06 (2006.01) B32B 7/12 (2006.01) C08G 18/12 (2006.01) C08G 18/42 (2006.01) C09J 11/08 (2006.01)

Patent

CA 2335567

The invention relates to a hot-melt adhesive with a melting point of at least 40 ~C, containing either a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with one functional group that can be polymerised by UV or electron beams or a polymer with at least one functional group that is reactive towards a compound with an acidic hydrogen atom and with no functional group that can be polymerised by UV or electron radiation; and a compound with a functional group that can be polymerised by UV or electron beams and a molecular weight (Mn) of less than 5,000.

L'invention concerne une colle à fusion dont le point de fusion est d'au moins 40 ·C, qui contient soit un polymère comportant au moins un groupe fonctionnel réagissant à un composé ayant un atome d'hydrogène acide et un groupe fonctionnel polymérisable par rayons U.V. ou électroniques, soit un polymère comportant au moins un groupe fonctionnel réagissant à un composé ayant un atome d'hydrogène acide, mais ne contient pas de groupe fonctionnel polymérisable par rayons U.V. ou électroniques, ainsi qu'un composé ayant un groupe fonctionnel polymérisable par rayons U.V. ou électroniques et dont le poids moléculaire (M¿n?) est inférieur à 5.000.

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