Adhesively bonded assembly with increased adhesion

Details Adhesively bonded assembly with increased adhesion Adhesively bonded assembly with increased adhesion

C - Chemistry, Metallurgy

09

J

C09J 5/00 (2006.01)

Patent

CA 2652978

The present invention relates to the field of adhesive bonding elements. It has been found that, through controlled contraction of the adhesive, it is possible to improve the adhesion to a multiplicity of substrates and thereby to increase the force between the joined components that is transmitted by the adhesive bonding element. A variety of methods are disclosed for how an adhesive bonding element with a contracted layer of adhesive can be produced.

La présente invention concerne le domaine des corps composites adhésifs. Il a été observé que la constriction ciblée de l'adhésif permet d'améliorer la force adhésive sur une pluralité de substrats, la force d'adhésion entre les partenaires d'assemblage du corps composite étant ainsi accrue. L'invention concerne différents procédés permettant de fabriquer un corps composite adhésif avec une couche adhésive constrite.

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