Adhesives containing exothermic crosslinker and alumina

Details Adhesives containing exothermic crosslinker and alumina Adhesives containing exothermic crosslinker and alumina

C - Chemistry, Metallurgy

09

J

C09J 161/10 (2006.01) B32B 21/14 (2006.01) C08K 3/22 (2006.01)

Patent

CA 2093026

Resole resins having a formaldehyde to phenol mole ratio within the range from about 2 to about 2.5 are used in an adhesive formulation having a crosslinking agent and finely divided aluminum oxide. The crosslinking agent provides in-situ reaction heat to enhance the curing rate of the resin. The aluminum oxide appears to serve both as a catalyst for the crosslinking reactions of the crosslinking agent and as a heat transfer facilitator for distributing the exothermic heat as well as the applied heat during the hot press step.

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