C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 163/10 (2006.01) C08F 290/06 (2006.01) C09J 201/02 (2006.01)
Patent
CA 2352125
Adhesive compositions containing a base resin and an epoxy resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.
Bonneau Mark R.
Hoang Gina
Shin Yun K.
Sobczak Martin
National Starch And Chemical Investment Holding Corporation
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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