Advanced epoxy resins having improved impact resistance when...

C - Chemistry – Metallurgy – 08 – L

Patent

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117/183, 402/252

C08L 63/02 (2006.01) C08G 59/06 (2006.01) C08G 59/38 (2006.01) C08G 65/08 (2006.01)

Patent

CA 1250079

ABSTRACT OF THE DISCLOSURE This invention pertains to advanced epoxy resin compositions comprising a product resulting from reacting (A) a mixture containing (1) at least one polyglycidyl ether of a material having at least two aliphatic hydroxyl groups per molecule, (2) at least one epoxy resin having an average of from 2.6 to 6 glycidyl ether groups per molecule attached to one or more aromatic rings and optionally (3) one or more glycidyl ethers of a dihydric phenol; with (A) at least one dihydric phenol in the presence of a suitable quantity of a suitable catalyst; and wherein components (A) and (B) are present in quantities which provide an epoxy to phenolic hydroxyl ratio of from 1.4:1 to 4 and wherein the number of epoxy equivalents contributed by component (A-3) to the number of epoxy equivalents contributed by component (A-2) to the number of epoxy equivalents contributed by component (A-1) is from 0:0.05:1 to 0.3:0.6:1. Coating compositions containing the afore- mentioned advanced epoxy resins have improved chip resistance, chemical resistance or pencil hardness when cured.

481763

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