Advanced gravity-film & double-helix heat exchangers

F - Mech Eng,Light,Heat,Weapons – 28 – D

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F28D 7/02 (2006.01) E03C 1/12 (2006.01) F16L 53/00 (2006.01) F16L 55/00 (2006.01) F28D 7/10 (2006.01) F28F 1/00 (2006.01) F28F 21/06 (2006.01)

Patent

CA 2556651

This invention teaches how to reduce the copper content of a commercially available, all-copper, double--wall-vented, coil & tube Gravity Film Heat Exchangers ("GFX") developed for the GFX.TM. system of U.S. Patent No. 4,619,311. For example, a GFX+TM equivalent of a residential Model G3-60 GFX can be made using 71% less copper. Such significant copper-savings, with comparable heat transfer coefficient ("U"), effectiveness and coil pressure drop, is achieved by improvements in innovations disclosed in Provisional Patent Application 60/709,889 (Filing date: August 22, 2005). Unlike conventional, single and multi-coil GFX's currently produced by several manufacturers, the present invention enables the use of a variety of metal and/or plastic components to achieve either single or vented-double-wall construction and lower manufacturing costs. In fact, higher U-values can be achieved by increasing the potable-water pressure drop of a GFX+ equivalent of any coil & tube GFX. The present invention also teaches how to simultaneously optimize U-values & pressure drop[s] and means of introducing controlled turbulence & mixing. Such trade-offs cannot be achieved in a conventional GFX design having one or more coils wound singly or in parallel. It also teaches how to manufacture an improved version of the Double-Helix Heat Exchanger ("DHX"), which is also disclosed in said Provisional Patent Application 60/709,889. Unlike a GFX, which must be installed vertically for best effectiveness, a DHX can be operated in any orientation. For applications permitting higher pressure drop, a DHX can be designed with a much higher U-value than a comparable GFX or GFX+.

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